Epoxy Resin Circuit Board Potting Compound Waterproof, 2110, 2.5 Grams

Description

Technical Product Bulletin
HIGH IMPACT EPOXY STAKING COMPOUND ROOM TEMPERATURE CURE
PRODUCT DESCRIPTION:
AA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, non-sag, non-drip and improved impact strength properties are required.
AA-BOND 2110 is easy-to-use two parts adhesive system contains no volatile solvents, readily cures at room temperature, and bonds to most materials including glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics.
AA-BOND 2110 is strong, tough, resilient, has superior mechanical impact and thermal shock resistance characteristics, and is also highly resistant to weather, water, gases and vapors, most petroleum products and fuels, salts, mild acids and alkalis, and many other organic and inorganic compounds.
GENERAL PROPERTIES:
Appearance:
Hazy off white
Cure Type:
Benefits:
Room temperature or Heat cure
High Impact strength
Good wetting
Long pot life
Mix Ratio by weight:
100:30 / Resin:Hardener
Substrates:
Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics
Operating Temperature:
-40 to 100 °C
Typical Applications:
PCB components, aerospace, anything where superior properties are required
UNCURED PROPERTIES:
Specific Gravity, mixed:
1.25 g/cc
Viscosity @25 °C, cps:
65000
Pot Life:
1 hour
CURE SCHEDULE:
10 hours
@ 65°C
24 hours
@ 25°C
MISC PROPERTIES:
Volume Resistivity:
9.30e+8 ohm-cm
Dielectric Constant:
4.7
Dielectric Strength:
430 kV/in
CTE, linear:
30.5 µin/in-°F @ RT
Hardness, Shore D:
80
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1
)
Carefully clean and dry all surfaces to be bonded.
2)
Apply
AA-BOND 2110
completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
Data Sheets:
TDS
| MSDS available upon request.
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